Advanced Semiconductor Packaging Market to Register a CAGR of
10.9% during 2017-2026
Semiconductor packaging provides protection to substrate and wafer. The
materials used in packaging semiconductor are metal, plastic, ceramic or glass.
However, manufacturers have started using some of the advanced semiconductor
packaging technologies such as flip-chip, Fan-Out Wafer-Level Packaging
(FO-WLP) Cheap Kids NFL
Jerseys , Fan-In Wafer-Level Packaging (FI-WLP) and 2.5D and 3D packaging.
Although 2.5D technology emerged as a bridge technology between 2D and 3D ICs,
it has evolved as largely used package solution alongside 3D ICs. The demand for
3D packaging is increasing due to constantly evolving wearable and portable
devices, and rapid development of electric vehicles. Also, High-Bandwidth Memory
(HBM) technology is which is already implemented in 2.5D packaging is also
expected to improve the power efficiency of IC packages.
Top three emerging trends that are contributing towards the growth of
the聽advanced semiconductor packaging market聽are the integration of semiconductor
in vehicles, changes in the size of
wafer Cheap Youth NFL
Jerseys , and increasing number of companies moving towards mergers and
acquisitions. Increasing demand for automation in vehicles is resulting in the
need for semiconductor devices of small size, thus driving the demand for
advanced semiconductor packaging solution in the automotive sector.聽 Increasing
number of merger and acquisitions are taking place in the semiconductor
packaging market. New companies are also using M&A route to compete in
already highly competitive market.
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Major companies currently active in the global advanced semiconductor
packaging market are ASE Group, Kyocera, Avery Dennison, Sumitomo Chemical Co.
Ltd. Cheap Womens NFL
Jerseys , Infineon, STMicroelectronics, Hitachi Chemical, Amkor
Technology, AMD Cheap Mens NFL
Jerseys , and Intel Corp.
Global Advanced Semiconductor Packaging Market to Witness Significant Growth
during the Forecast Period
As per the report by Transparency Market Research (TMR), the global advanced
semiconductor packaging market is expected to witness strong growth, registering
a CAGR of 10.9% during 2017-2026. The global advanced semiconductor packaging
market is also estimated to reach US$ 67,208.2 million revenue by 2026 end.
The global advanced semiconductor packaging market is segmented into
application, packaging type Cheap
NFL Jerseys China Online , end user, and region. Based on the packaging
type, the market is segmented into 2.5D3D, Flip Chip (FC), Fan-In Wafer-Level
Packaging (FI WLP) Cheap NFL
Jerseys China Wholesale , and Fan-Out Wafer-Level Packaging (FO WLP). Flip
Chip (FC) is expected to witness the highest growth during the forecast period.
By application, Central Processing UnitsGraphical Processing Units are
anticipated to witness significant growth during 2017-2026.
End Users are further segmented into consumer electronics, medical devices,
aerospace and defense,
automotive Cheap NFL Jerseys
Online , telecommunications, and other end users. Among these, consumer
electronics are expected to be the largest users of advanced semiconductor
packaging during the forecast period.
APEJ to Remain Dominant in the Global Advanced Semiconductor Packaging Market
Asia Pacific Excluding Japan (APEJ) is likely to dominate the global advanced
semiconductor packaging market from 2017 to 2026. Presence of the major market
players in the region is one of the factors driving the market growth. Companies
are also investing in countries such as China to develop research and
development facility and chip packaging manufacturing facilities. As emerging
economies such as China are focusing more on advanced technologies, 2.5D IC and
3D ICs are being used on a large scale for chip packaging. Also, low labor cost
and availability of cheap raw material are leading towards the significant
growth of advanced semiconductor packaging market.
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